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3D IC Stacking Technology by Banqiu Wu,Ajay Kumar,Sesh Ramaswami

By Banqiu Wu,Ajay Kumar,Sesh Ramaswami

The most recent advances in three-d built-in circuit stacking technology

With a spotlight on business functions, 3D IC Stacking Technology bargains entire insurance of layout, try, and fabrication processing equipment for third-dimensional machine integration. each one bankruptcy during this authoritative advisor is written through specialists and information a separate fabrication step. destiny functions and state of the art layout capability also are mentioned. this is often an important source for semiconductor engineers and transportable machine designers.

3D IC Stacking Technology covers:

  • High density via silicon stacking (TSS) technology
  • Practical layout surroundings for heterogeneous 3D IC products
  • Design automation and TCAD software strategies for via silicon through (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper electrodeposition for TSV
  • Chemical mechanical sharpening for TSV applications
  • Temporary and everlasting bonding
  • Assembly and try facets of TSV technology

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